Advantages in Terminal Stamping Manufacturing
Terminals are core components in electronic connectors, and they need high precision and quality. Our company have decades of stamping expertise to meet these requirements.
Our Advantages
Hlgh Precision
Critical items such as bend angles and pin pitches are held within tolerances of less than 0.05 mm. Our machining equipment achieves ±2 µm accuracy, far higher than stamping die requirements.
Superior Surface Quality
Terminal surfaces must be burr- and scratch-free as these can affect conductivity and plating quality. That means the cutting edges must be very sharp and the clearances must be small and uniform. This enable a clean, burr-free stamping surface.
Complex Geometry Expertise
Multiple forming operations are needed for stamping terminals—blanking, bending, cutting, and deep drawing. We need to combine into a single progressive die, this need a rich expierence engineer.
High-Speed & Long Tool Life
Some stamping die need 1,000+ strokes per minute, to ensure this, our dies use high-rigidity materials like SKD11, DC53, and tungsten carbide alloys to ensure durability and service life under continuous operation.
How We Ensure Progressive Die Quality
- Precision Guiding System Ball-bearing guide posts, bushings, and dual guiding mechanisms ensure perfect match during high-speed stamping process.
- Perfect Plate Assembly Manufactured to the highest tolerances, our plate assemblies prevent movement or deformation during clamping.
- High quality Forming System All punches and dies are fabricated from ultra-hard, wear-resistant materials—including SKH-51, SKD11, DC53, and tungsten carbide alloys (YC20C, YG20)—ensuring longevity and consistent runs.
- Accurate Feeding & Positioning Our automatic feeding system feeds material step-by-step, while guide pins engage pre-punched positioning holes before each station. This avoid feeding misalignment in production.
- Safety & Monitor system Misalignment or feeding errors are detected instantly, it will automaticly shutdown to prevent mold damage and minimize downtime.
